Open AccessSpecial Section of Review Articles From Intel Corporation
Author(s) -
Jin Yang
Publication year - 2019
Publication title -
journal of electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.4042803
Subject(s) - publication , corporation , computer science , microelectronics , engineering , mechanical engineering , telecommunications , manufacturing engineering , electrical engineering , business , finance , advertising
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