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The increasing heat densities in electronic components and focus on energy efficiency have motivated utilization of embedded two-phase cooling, which reduces system-level thermal resistance and pumping power. To achieve maximum benefit, high heat fluxes and vapor qualities should be achieved simultaneously. While many researchers have achieved heat fluxes in excess of 1 kW/cm2, vapor qualities are often below 10%, requiring a significantly large amount of energy spent on subcooling or pumping power, which minimizes the benefit of using two-phase thermal transport. In this work, we describe our recent work with cooling devices utilizing film evaporation with an enhanced fluid delivery system (FEEDS). The design, calibration, and experimental testing of a press-fit and bonded FEEDS test section are detailed here. Heat transfer and pressure drop performance was characterized and discussed. With the press-fit Si test chip, heat fluxes in excess of 1 kW/cm2 were obtained at vapor qualities approaching 45% and a coefficient of performance (COP) approaching 1400. With the bonded SiC test chip, heat fluxes in excess of 1 kW/cm2 were achieved at a vapor quality of 85% and heat densities approaching 490 W/cm3.

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers