Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333]
Author(s) -
R.C. Jaeger,
Mohammad Motalab,
Safina Hussain,
Jeffrey C. Suhling
Publication year - 2017
Publication title -
journal of electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.4038735
Subject(s) - van der pauw method , sign (mathematics) , electrical engineering , bridge (graph theory) , stress (linguistics) , silicon , materials science , physics , engineering , structural engineering , mechanical engineering , optoelectronics , mathematics , electrical resistivity and conductivity , mathematical analysis , hall effect , surgery , philosophy , medicine , linguistics
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