Open AccessSpecial Section on InterPACK 2015
Author(s) -
Satish C. Chaparala,
Ashish Gupta,
Mehdi Asheghi,
Jeffrey C. Suhling,
Tōru IKEDA,
Xiaobing Luo
Publication year - 2016
Publication title -
journal of electronic packaging
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.4032748
Subject(s) - thermal management of electronic devices and systems , electronics , microelectromechanical systems , microscale chemistry , nanoelectromechanical systems , mechanical engineering , special section , engineering , reliability (semiconductor) , manufacturing engineering , nanotechnology , engineering physics , electrical engineering , materials science , physics , nanomedicine , mathematics , quantum mechanics , nanoparticle , power (physics) , mathematics education
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