Open AccessSpecial Issue on Thermodynamics, Flow, and Heat Transfer in MEMS
Publication year - 2014
Publication title -
journal of electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.4027498
Subject(s) - heat transfer , thermodynamics , microelectromechanical systems , thermal science , flow (mathematics) , mechanics , materials science , mechanical engineering , critical heat flux , physics , heat transfer coefficient , engineering , nanotechnology
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