Open AccessErratum: “A Stepped-Bar Apparatus for Thermal Resistance Measurements” [Journal of Electronic Packaging, 2013, 135(4), 041002]
Publication year - 2013
Publication title -
journal of electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.4025800
Subject(s) - bar (unit) , materials science , thermal resistance , mechanical engineering , electronic packaging , thermal , composite material , electrical engineering , engineering , thermodynamics , physics , meteorology
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