Open AccessDiscussion: “Yield Function for Solder Elastoviscoplastic Modeling” (Dube, M., and Kundu, T., 2005, ASME J. Electron. Packag., 127, pp. 147–156)
Author(s) -
Chandra S. Desai
Publication year - 2011
Publication title -
journal of electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.4000901
Subject(s) - soldering , yield (engineering) , materials science , viscoplasticity , mechanics , mechanical engineering , composite material , physics , thermodynamics , engineering , finite element method , constitutive equation
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