Open AccessMechanical Design of Electronic Systems
Author(s) -
J.H.L. Pang
Publication year - 2010
Publication title -
journal of electronic packaging
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.4000755
Subject(s) - electronics , electronic component , electronic packaging , integrated circuit packaging , mechanical engineering , engineering , printed circuit board , interconnection , integrated circuit , circuit design , flip chip , electrical engineering , materials science , layer (electronics) , telecommunications , adhesive , composite material
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