Closure to “Discussion of ‘A Photoelastic Approach to Transient Stress Problems Employing Low-Modulus Materials’” (1960, ASME J. Appl. Mech., 27, p. 369) | Zendy

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Closure to “Discussion of ‘A Photoelastic Approach to Transient Stress Problems Employing Low-Modulus Materials’” (1960, ASME J. Appl. Mech., 27, p. 369)

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