Open AccessThermal Investigations of Integrated Circuits and Systems, THERMINIC'09
Author(s) -
M. Rencz
Publication year - 2011
Publication title -
journal of electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.3565444
Subject(s) - electronic circuit , materials science , thermal , integrated circuit , mechanical engineering , engineering , electrical engineering , physics , optoelectronics , thermodynamics
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