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Principles of Electronic Packaging
Author(s) -
D. P. Seraphim,
Ronald C. Lasky,
CheYu Li,
Peter A. Engel
Publication year - 1989
Publication title -
journal of electronic packaging
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.3226524
Subject(s) - electronic packaging , materials science , integrated circuit packaging , mechanical engineering , engineering , integrated circuit , composite material , optoelectronics

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