Open AccessSpecial Issue on Mechanics of Surface Mount Assemblies
Author(s) -
Donald E. Barker,
H. Conrad,
Peter Engel,
John Lan,
Yi-Hsin Pao,
Anthony J. Rafanelli,
Harvey Solomon,
Donald S. Stone
Publication year - 1992
Publication title -
journal of electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.2906403
Subject(s) - mount , mechanics , surface (topology) , materials science , mechanical engineering , engineering , physics , mathematics , geometry
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