Open AccessHandbook of Tape Automated Bonding
Author(s) -
John H. Lau,
William T. Chen
Publication year - 1992
Publication title -
journal of electronic packaging
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.2905486
Subject(s) - bumping , rework , interconnection , engineering , wire bonding , material selection , wafer bonding , integrated circuit packaging , mechanical engineering , materials science , wafer , electrical engineering , composite material , integrated circuit , embedded system , telecommunications , chip
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