Open AccessSolder Joint Reliability—Theory and Applications
Author(s) -
John H. Lau,
Peter A. Engel
Publication year - 1992
Publication title -
journal of electronic packaging
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.2905434
Subject(s) - reliability (semiconductor) , soldering , joint (building) , reliability engineering , stress (linguistics) , reliability theory , finite element method , structural engineering , materials science , mechanical engineering , computer science , forensic engineering , engineering , composite material , physics , thermodynamics , failure rate , power (physics) , linguistics , philosophy
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