Open AccessThe Finite Element in Thermomechanics
Author(s) -
Tai–Ran Hsu,
John H. Lau
Publication year - 1991
Publication title -
journal of electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.2905415
Subject(s) - finite element method , materials science , structural engineering , stress (linguistics) , mechanical engineering , mechanics , engineering , physics , philosophy , linguistics
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