Open AccessSpecial Issue on Mechanics of Surface Mount Assemblies
Author(s) -
Peter A. Engel,
John H. Lau,
Yi-Hsin Pao,
Anthony J. Rafanelli,
Mohamed Zarrugh,
Alex Zubelewicz
Publication year - 1991
Publication title -
journal of electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.2905389
Subject(s) - mount , surface mount technology , surface (topology) , mechanics , mechanical engineering , fluid mechanics , materials science , engineering , physics , printed circuit board , electrical engineering , geometry , mathematics
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