Open AccessDiscussion: Notes on Microelectronics Packaging Handbook by Rao Tummala and Eugene Rymaszewski, Van Nostrand, 1988
Author(s) -
Boris Mirman
Publication year - 1990
Publication title -
journal of electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.2904361
Subject(s) - microelectronics , engineering physics , engineering , materials science , electronic packaging , electrical engineering , mechanical engineering
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