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Modeling of the Mechanical Behavior of Materials in “High-Tech” Systems: Attributes and Review
Author(s) -
E. Suhir
Publication year - 1999
Publication title -
journal of electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.2793843
Subject(s) - microelectronics , field (mathematics) , computer science , work (physics) , mechanical engineering , industrial engineering , engineering physics , engineering , electrical engineering , mathematics , pure mathematics
We examine some attributes of modeling of the mechanical behavior of materials and structures in microelectronics and photonics (mainly fiber optics) engineering. The merits and shortcomings of experimental and theoretical modeling are addressed, as well as the interaction between different modeling approaches. The concepts discussed are illustrated by a brief review of the published work in the field. The review is based primarily on the author’s research conducted during his work at Bell Laboratories and reflects, to a great extent, the state-of-the-art in modeling of the mechanical behavior of “high-tech” materials and structures. “The only real voyage to discovery consists not in seeking new landscapes, but in having new eyes.” [Marcel Proust, French Writer] “The Practical value of mathematics is, in effect, a possibility to obtain, with its help, results simpler and faster.” [Andrey Kolmogorov, Russian Mathematician]

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