An Investigation of PWB Layout by Genetic Algorithms to Maximize Fatigue Life | Zendy

Andrew J. Scholand | Zendy; Robert E. Fulton | Zendy; Bert Bras | Zendy

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An Investigation of PWB Layout by Genetic Algorithms to Maximize Fatigue Life

Author(s) -

Andrew J. Scholand,

Robert E. Fulton,

Bert Bras

Publication year - 1999

Publication title -

journal of electronic packaging

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.523

H-Index - 52

eISSN - 1528-9044

pISSN - 1043-7398

DOI - 10.1115/1.2792658

Subject(s) - printed circuit board , finite element method , genetic algorithm , implementation , chip , computer science , epoxy , thermal , electronic packaging , mechanical engineering , engineering , electronic engineering , materials science , structural engineering , electrical engineering , machine learning , physics , meteorology , composite material , programming language

Thermal considerations in Printed Wiring Board (PWB) assemblies are becoming increasingly important as packaging constraints shrink and power use escalates. In this paper, we provide a study on the potential for a Genetic Algorithm-driven PWB layout design tool to improve the thermal performance of such assemblies. As a case study, the thermo-mechanical fatigue of surface mounted leadless chip carriers on an FR4 epoxy board is used. We have found that by utilizing appropriate formula- based engineering approximations, the efficiency of Genetic Algorithms in finding near-optimal and optimal results makes this approach effective as an explorative 'scouting' approach to identify promising board configurations for more computationally expensive evaluations such as finite element method.

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