Open AccessModern Solder Technology for Competitive Electronics Manufacturing
Author(s) -
Jennie S. Hwang,
Anthony J. Rafanelli
Publication year - 1997
Publication title -
journal of electronic packaging
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.2792238
Subject(s) - soldering , electronics , manufacturing engineering , materials science , electronic packaging , mechanical engineering , engineering physics , engineering , electrical engineering , composite material
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