Open AccessQuality Conformance and Qualification of Microelectronic Packages and Interconnects
Author(s) -
Michael Pecht,
Abhijit Dasgupta,
John Evans,
Jillian Y. Evans,
Anthony J. Rafanelli
Publication year - 1997
Publication title -
journal of electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.2792205
Subject(s) - rework , microelectronics , flip chip , materials science , ceramic , wire bonding , integrated circuit packaging , substrate (aquarium) , chip , interconnection , chip scale package , dielectric , composite material , integrated circuit , optoelectronics , electrical engineering , computer science , engineering , adhesive , embedded system , wafer , layer (electronics) , telecommunications , oceanography , geology
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