Open AccessChip on Board: Technologies for Multichip Modules
Author(s) -
John H. Lau,
Richard J. Prosman
Publication year - 1995
Publication title -
journal of electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.2792085
Subject(s) - flip chip , bumping , interconnection , chip , chip scale package , soldering , wire bonding , thermal copper pillar bump , wafer bonding , materials science , printed circuit board , wafer , integrated circuit packaging , optoelectronics , integrated circuit , electrical engineering , engineering , mechanical engineering , nanotechnology , composite material , telecommunications , adhesive , layer (electronics)
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