Open AccessErratum: “Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model” [Journal of Electronic Packaging, 2005, 127(3), pp. 290–298]
Author(s) -
Mudasir Ahmad,
Ken Hubbard,
Mason Hu
Publication year - 2006
Publication title -
journal of electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.2165648
Subject(s) - viscoplasticity , soldering , joint (building) , materials science , electronic packaging , mechanical engineering , finite element method , computer science , structural engineering , composite material , engineering , constitutive equation
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