Open AccessForeword
Author(s) -
Bahgat Sammakia,
Dereje Agonafer
Publication year - 2004
Publication title -
journal of electronic packaging
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.1827273
Subject(s) - materials science , mechanical engineering , engineering
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