Open AccessSolders and Soldering
Author(s) -
Howard H. Manko,
Anthony J. Rafanelli
Publication year - 2002
Publication title -
journal of electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.1503063
Subject(s) - soldering , dip soldering , joint (building) , work (physics) , computer science , mechanical engineering , manufacturing engineering , engineering , metallurgy , materials science , wave soldering , architectural engineering
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