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CMOS-MEMS Integration in Micro Fabry Perot Pressure Sensor Fabrication
Author(s) -
Nor Hafizah Ngajikin,
Low Yee Ling,
Nur ‘Izzati Ismail,
Abu Sahmah M. Supa’at,
Mohd Haniff Ibrahim,
Norazan Mohd Kassim
Publication year - 2013
Publication title -
jurnal teknologi
Language(s) - English
Resource type - Journals
eISSN - 2180-3722
pISSN - 0127-9696
DOI - 10.11113/jt.v64.2083
Subject(s) - deep reactive ion etching , microelectromechanical systems , fabrication , materials science , pressure sensor , cmos , optoelectronics , wafer , optical fiber , fabry–pérot interferometer , diaphragm (acoustics) , etching (microfabrication) , reactive ion etching , wavelength , electrical engineering , optics , engineering , nanotechnology , mechanical engineering , medicine , alternative medicine , physics , layer (electronics) , pathology , loudspeaker
Integration of Complimentary Metal-Oxide-Semiconductor (CMOS) and Microelectromechanical System (MEMS) technology in Fabry Perot blood pressure sensor (FPPS) fabrication processes is presented. The sensor that comprises of a 125 µm diameter of circular diaphragm is modeled to be fabricated using integration of CMOS-MEMS technology. To improve the sensor reliability, a sleeve structure is designed at the back of Silicon wafer by using MEMS Deep Reactive ion Etching (DRIE) process for fiber insertion, which offers a large bonding area. Optical light source at 550 nm wavelength is chosen for this device. The sensor diaphragm mechanic deflection and its optical spectrum is theoretically analyzed and simulated. The analytical results show high linear response in the range of 0 to 40 kPa and a reasonable sensitivity of 1.83 nm/kPa (spectrum shift/pressure) has been obtained for this sensor. The proposed integration of CMOS-MEMS technology limit the material selection yet produces an economical method of FPPS fabrication and integrated system.

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