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Addressing amorphization and transgranular fracture of B 4 C through Si doping and TiB 2 microparticle reinforcing
Author(s) -
Hwang Chawon,
Du Jun,
Yang Qirong,
Celik Azmi M.,
Christian Kent,
An Qi,
Schaefer Mark C.,
Xie Kelvin Y.,
LaSalvia Jerry C.,
Hemker Kevin J.,
Goddard William A.,
Haber Richard A.
Publication year - 2022
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/jace.18223
Subject(s) - boron carbide , transgranular fracture , materials science , brittleness , ceramic , doping , carbide , boron , fracture (geology) , metallurgy , silicon carbide , brittle fracture , composite material , grain boundary , microstructure , optoelectronics , intergranular fracture , chemistry , organic chemistry
Over the last two decades, many studies have contributed to improving our understanding of the brittle failure mechanisms of boron carbide and provided a road map for inhibiting the underlying mechanisms and improving the mechanical response of boron carbide. This paper provides a review of the design and processing approaches utilized to address the amorphization and transgranular fracture of boron carbide, which are mainly based on what we have found through 9 years of work in the field of boron carbides as armor ceramics.