Developing new joining materials for low-temperature electronics assembly | Zendy

P. Roumanille | Zendy; V. Baco | Zendy; C. Bonningue | Zendy; M. Gougeon | Zendy; P. Tailhades | Zendy; P. Monfraix | Zendy

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Developing new joining materials for low-temperature electronics assembly

Author(s) -

P. Roumanille,

V. Baco,

C. Bonningue,

M. Gougeon,

P. Tailhades,

P. Monfraix

Publication year - 2016

Publication title -

2016 ieee nanotechnology materials and devices conference (nmdc)

Language(s) - English

Resource type - Conference proceedings

ISBN - 978-1-5090-4352-1

DOI - 10.1109/nmdc.2016.7777169

Subject(s) - aerospace , bioengineering , components, circuits, devices and systems , engineered materials, dielectrics and plasmas , fields, waves and electromagnetics , photonics and electrooptics , power, energy and industry applications

New regulations due to environmental and health concerns including the European RoHS (Restriction of Hazardous Substances) and WEEE (Waste Electric and Electrical Equipment) directives have led to a shift towards tin-based, lead-free solders in electric and electronic equipment. For the assembly of electronic devices on printed circuit boards (2 nd level packaging), the most widely used lead-free alloy is near eutectic tin-silver-copper (Sn-Ag-Cu or SAC). Compared to tin-lead based solders, the higher melting points of SAC solders can result in additional stress, accelerated ageing and a global decrease in reliability for components and polymer-based printed circuit boards during reflow processing. These recent concerns have led to new research and development in lead-free solders area [1]. Numerous new alloy compositions are being investigated as well as new approaches like manufacturing alloy nanoparticles or improving mechanical properties with nanoparticle reinforcements in conventional micrometre-sized solders.

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