z-logo
HomeZAIABlog
open-access-imgOpen Access
MCM: The High-Performance Electronic Packaging Technology
Author(s) -
Ponnathpur R. Mukund,
J. F. McDonald
Publication year - 1993
Publication title -
computer
Language(s) - English
DOI - 10.1109/mc.1993.10038

The content you want is available to Zendy users.

Already have an account? Click here to sign in.
Having issues? You can contact us here
Accelerating Research

Address

John Eccles House
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom

About

AboutCareersPublisher PartnersContact UsGet Organisational Trial or Quote

Learn

FAQsBlogTerms of UsePrivacy Policy

Download the Zendy App

Get it on
Google Play
Download on the
App Store

Discover

Explore

Copyright Knowledge E © 2026. All Rights Reserved.