Bi-Modal Variability of nFinFET Characteristics During Hot-Carrier Stress: A Modeling Approach
Author(s) -
Alexander Makarov,
B. Kaczer,
Adrian Chasin,
Michiel Vandemaele,
E. Bury,
Markus Jech,
Alexander Grill,
Geert Hellings,
Al-Moatasem El-Sayed,
Tibor Grasser,
Dimitri Linten,
Stanislav Tyaginov
Publication year - 2019
Publication title -
ieee electron device letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.337
H-Index - 154
eISSN - 1558-0563
pISSN - 0741-3106
DOI - 10.1109/led.2019.2933729
Subject(s) - stress (linguistics) , degradation (telecommunications) , trap (plumbing) , voltage , boltzmann equation , cumulative distribution function , materials science , modal analysis , physics , computational physics , electronic engineering , probability density function , electrical engineering , mathematics , statistics , engineering , finite element method , thermodynamics , philosophy , linguistics , meteorology
We present a statistical analysis of the cumulative impact of random traps (RTs) and dopants (RDs) on hot-carrier degradation (HCD) in n-channel FinFETs. Calculations are performed at three combinations of high stress voltages and for conditions close to the operating regime. We generate 200 different configurations of devices with RDs and subsequently solve the Boltzmann transport equation to obtain the continuous interface trap concentration ${N} _{\text {it}}$ . These deterministic densities ${N} _{\text {it}}$ for each individual configuration are randomized and converted to 200 different configurations of RTs, yielding a total amount of 40,000 samples in our study. The analysis shows that at high stress voltages (with both RTs and RDs taken into account) probability densities of linear drain currents and device lifetimes are close to a bi-modal normal distribution, while in the operating regime such a trend is not visible.
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