Techical Program Co-Chairs' Message

Hidekazu Terai Nikil Dutt Xianlong Hong On behalf of the Technical Program Committee for the Asia and South Pacific Design Automation Conference 2004, we would like to welcome all of you to the conference held from January 27 through 30, 2004 at Pacifico Yokohama Conference Center in Yokohama City, Japan. We had 291 paper submissions for the technical sessions. This is a 24% increase in submissions over last year. The submissions span 30 countries/regions in Asia, North America, South America, Europe, Oceania, and Africa. The conference’s Technical Program Committee was composed of 143 professionals who are experts on EDA, LSI design, and embedded system design, and was organized into 11 topic groups. Each topic group selected high quality papers through in-depth and prudent discussions. Finally, among the submitted papers, 100 and 48 papers were accepted as regular and short papers, respectively. Consequently, the acceptance ratio of 50.8 is almost the same as last year’s event. Accepted papers will be presented in 35 technical sessions, with 5 parallel tracks on January, 28 and 4 parallel tracks on January, 29 and 30. In addition to the regular technical sessions, we have several keynote address speeches and special sessions. The special sessions are composed of two panel discussions, two invited talks, and three embedded tutorials. Panel discussions are scheduled in Sessions 3E and 9C. Session 3E, organized by R. Rajsuman and K. Hatayama, is titled ”Opportunities with the Open Architecture Test System”. Session 9C, organized by M. Kawamura, is titled ”Future Reconfigurable Computing Architectures”. Invited talk sessions are also organized by a number of distinguished researchers and engineers. Session 1A titled ”Selected European Activities in SoC Low Power Design Methodologies and Research Networking” will present many hot topics concerned with the situation of low power chip design and the related research activities in Europe. Session 4A titled ”C-based Design Examples” will present examples of successful C-based designs in companies. Three tutorial talks by top researchers are also embedded in the technical sessions. The subjects in these tutorials cover recent important progresses in embedded system applications, modeling and methodology for Radio Frequency IC, and design for manufacturability (DFM) in nanometer era. These special sessions will provide you with a wide variety of hot and exciting topics from system level to circuits, test and physical level design. As Co-Chairs of the Technical Program Committee, we would like to thank all members of the Technical Program Committee; Topic Chairs and their Vice Topic Chairs, K. Wakabayashi, D. Araki, H. Takada, H. Tomiyama, Y. Matsunaga, K. Eguchi, M. Toyonaga, M. Hashimoto, T. Watanabe, K. Takamizawa, T. Hayashi, K. Nakane, K. Mashiko, S. Kawahito, H. Masuda, M. Kawamura, H. Amano, and T. Onoye, and reviewers of papers, session organizers and moderators. We would like to express our sincere thanks to authors who submitted papers and speakers who will present their papers at the conference. We are grateful to the Publication Chair, K Kobayashi for his contributions in preparing the advance and final program brochures and the proceedings of the conference. We also thank the TPC Vice Chair, M. Fujita, and the TPC Secretaries K. Hamaguchi, M. Fukui, and K. Sakanushi for their contribution towards the de-