Open AccessColor Quality Improvement of Micro LED Display Image by TMP LED Design
Author(s) -
Hsiao-Wen Lee,
Ting-Jay Wang,
Bor-Shyh Lin
Publication year - 2018
Publication title -
ieee access
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.587
H-Index - 127
ISSN - 2169-3536
DOI - 10.1109/access.2018.2880090
Subject(s) - aerospace , bioengineering , communication, networking and broadcast technologies , components, circuits, devices and systems , computing and processing , engineered materials, dielectrics and plasmas , engineering profession , fields, waves and electromagnetics , general topics for engineers , geoscience , nuclear engineering , photonics and electrooptics , power, energy and industry applications , robotics and control systems , signal processing and analysis , transportation
In recent years, Micro LED technology has been popularly developed. How to improve the issue of color stability in Micro LED technology is an important and also a difficult research topic. Here, the brightness decay and color displacement in high chip temperature are the two major factors in the color quality of Micro LED display image. In this paper, the technique of thin metal package is applied in the LED package to effectively improve the material thermal resistance of the LED package. By improving the material thermal resistance of the LED package, it could improve the brightness decay 5% in LED high junction temperature. The proposed method could reduce 0.01 of Cx displacement in LED high junction temperature and control Cy displacement less than 0.005 in chip junction temperature 45° to 110°. From the experimental results, the proposed method could exactly improve the color quality of quantum well Micro LED display image in high temperature.
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