English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

The multilayer technology constitutes the ultimate solution for the design of high-density printed circuit board (PCB). Challenging modeling method is required to predict the signal integrity (SI) of the multilayer PCB. This paper addresses an unfamiliar direct time-domain model of a 3-D multilayer hybrid PCB. The subnetwork primitive elements of the equivalent graph are constituted by lumped components, interconnect lines, vias, pads, and anti-pads. The tensorial analysis of networks (TANs) is used to solve the problem related to the graph topology in the function of the PCB design parameters. The TAN concept is based on the interaction between the primitive elements. The mesh currents constitute the proposed computational unknowns. The unfamiliar model is validated with a three-port network prototype constituted by the six-layer PCB, including passive SMD components. In the frequency domain, S-parameter validation from 100 kHz to 5 GHz is presented. By using 80-Mb/s and 0.5-Gb/s rate data patterns, the proposed TAN model is validated by both simulations and measurements in the time domain. The transient results present vector magnitude relative error accuracy lower than 15%. Thanks to the computation speed and adaptability to multilayer hybrid structures, the TAN model is a prominent approach for the SI and power integrity analyses of 3-D multilayer structures.

Direct Time-Domain TAN Model of 3D Multilayer Hybrid PCB: Experimental Validation