Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method
Author(s) -
Jinn-Tsong Tsai,
Cheng-Chung Chang,
Wen-Ping Chen,
Jyh-Horng Chou
Publication year - 2016
Publication title -
ieee access
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.587
H-Index - 127
ISSN - 2169-3536
DOI - 10.1109/access.2016.2581258
Subject(s) - aerospace , bioengineering , communication, networking and broadcast technologies , components, circuits, devices and systems , computing and processing , engineered materials, dielectrics and plasmas , engineering profession , fields, waves and electromagnetics , general topics for engineers , geoscience , nuclear engineering , photonics and electrooptics , power, energy and industry applications , robotics and control systems , signal processing and analysis , transportation
Fuzzy logic Taguchi method (FLTM) is used to optimize parameters for wire bonding process. The proposed FLTM integrates orthogonal arrays, signal-to-noise ratios, response tables, analysis of variance (ANOVA), fuzzy logic, and multiple performance characteristics index. The main process parameters for wire bonding are ultrasonication time, ultrasonication power, bond force, bond force time, and search force. The output responses include ball shear and ball size. The orthogonal arrays, signal-to-noise ratios, and response tables reduce the number of experiments needed to find the best factor-level combinations. The significant control factors are determined by ANOVA. In engineering practice, ball size increases as ball shear increases, but an excessively large ball size causes a short circuit, whereas an excessively small ball size cannot provide enough ball shear. Due to the two contradictory output responses, the FLTM is used to find the best process parameters. The experimental results show that the process parameters obtained by the FLTM result in a smaller ball size and a larger ball shear compared with those obtained by statistical methods, artificial intelligence techniques, and previous designs.
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