Fay meets van der Pauw: the trisecant identity and the resistivity of holey samples

The van der Pauw method is commonly used in the applied sciences to find the resistivity of a simply connected, two-dimensional conducting laminate. Given the usefulness of this ‘4-point probe’ method there has been much recent interest in trying to extend it to holey, that is, multiply connected, samples. This paper introduces two new mathematical tools to this area of investigation—the prime function on the Schottky double of a planar domain and the Fay trisecant identity—and uses them to show how the van der Pauw method can be extended to find the resistivity of a sample with a hole. We show that an integrated form of the Fay trisecant identity provides valuable information concerning the appearance of ‘envelopes’ observed in the case of holey samples by previous authors. We find explicit formulae for these envelopes, as well as an approximate formula relating two pairs of resistance measurements to the sample resistivity that is expected to be valid when the hole is sufficiently small and not too close to the outer boundary. We describe how these new mathematical tools have enabled us to prove certain conjectures recently made in the engineering literature.