The stress field near the tip of a plane stress crack in a gel consisting of chemical and physical cross-links
Author(s) -
Jingyi Guo,
ChungYuen Hui,
Mincong Liu,
Alan T. Zehnder
Publication year - 2019
Publication title -
proceedings of the royal society a mathematical physical and engineering sciences
Language(s) - English
Resource type - Journals
eISSN - 1471-2946
pISSN - 1364-5021
DOI - 10.1098/rspa.2018.0863
Subject(s) - viscoelasticity , hyperelastic material , materials science , plane stress , stress field , mechanics , stress (linguistics) , finite element method , transient (computer programming) , plane (geometry) , structural engineering , field (mathematics) , enhanced data rates for gsm evolution , composite material , geometry , physics , mathematics , computer science , engineering , linguistics , philosophy , pure mathematics , operating system , telecommunications
We study the time-dependent asymptotic stress fields near the tip of a mode I plane stress crack in a hydrogel. The analysis is based on a three-dimensional continuum model which describes the viscoelastic behaviour of a hydrogel gel with permanent and transient cross-links. The viscoelasticity results from the breaking and healing of the transient cross-links in the gel network. We show that the crack tip fields satisfy a local correspondence principle—that is, the spatial singularities of these fields are identical to a hyperelastic cracked body with the same but undamaged networks. Asymptotic results compare very well with finite-element simulations on a single-edge crack specimen loaded under constant stretch rate. We also compare the theoretical results (crack opening profile and crack tip strain field) with experiments and find excellent agreement.
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom