Thermal strain imaging: a review
Author(s) -
Chi Hyung Seo,
Yan Shi,
Sheng-Wen Huang,
Kang Kim,
Matthew O’Donnell
Publication year - 2011
Publication title -
interface focus
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.1
H-Index - 49
eISSN - 2042-8901
pISSN - 2042-8898
DOI - 10.1098/rsfs.2011.0010
Subject(s) - computer science , strain (injury) , exploit , field (mathematics) , thermal , data science , characterization (materials science) , materials science , medicine , nanotechnology , physics , mathematics , computer security , meteorology , pure mathematics
Thermal strain imaging (TSI) or temporal strain imaging is an ultrasound application that exploits the temperature dependence of sound speed to create thermal (temporal) strain images. This article provides an overview of the field of TSI for biomedical applications that have appeared in the literature over the past several years. Basic theory in thermal strain is introduced. Two major energy sources appropriate for clinical applications are discussed. Promising biomedical applications are presented throughout the paper, including non-invasive thermometry and tissue characterization. We present some of the limitations and complications of the method. The paper concludes with a discussion of competing technologies.
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