Open AccessBackplate-reinforced structures for enhancing solder joint reliability of server CPU assembly under thermal cycling
Author(s) -
M. C. Liao,
P. S. Huang,
Te-Chin Huang,
Μ. Y. Tsai
Publication year - 2021
Publication title -
journal of mechanics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.27
H-Index - 23
eISSN - 1811-8216
pISSN - 1727-7191
DOI - 10.1093/jom/ufab035
Subject(s) - materials science , soldering , ball grid array , temperature cycling , joint (building) , composite material , finite element method , surface mount technology , structural engineering , ball (mathematics) , thermal , engineering , mathematical analysis , physics , mathematics , meteorology
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