Open AccessWarpage modeling and characterization of intelligent power modules (IPMs)
Author(s) -
Meng-Kai Shih,
Tai-Kuang Lee,
JingYao Chang
Publication year - 2021
Publication title -
journal of mechanics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.27
H-Index - 23
eISSN - 1811-8216
pISSN - 1727-7191
DOI - 10.1093/jom/ufab025
Subject(s) - lead frame , materials science , taguchi methods , ceramic , molding (decorative) , epoxy , foil method , composite material , reliability (semiconductor) , substrate (aquarium) , design of experiments , layer (electronics) , mechanical engineering , power (physics) , engineering , mathematics , oceanography , semiconductor device , physics , quantum mechanics , geology , statistics
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