Open AccessSimulation and experimental investigation of contact spot temperature for electrical contact components
Author(s) -
Chao Zhang,
Zhao Zien,
Wanbin Ren
Publication year - 2021
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/1207/1/012021
Subject(s) - electrical contacts , contact resistance , multiphysics , materials science , contact angle , electrical current , finite element method , electrical resistance and conductance , contact force , mechanical engineering , reliability (semiconductor) , thermal contact conductance , composite material , mechanics , electrical engineering , engineering , structural engineering , thermal resistance , heat transfer , power (physics) , physics , thermodynamics , layer (electronics) , quantum mechanics
The contact spot temperature of electrical contact components substantially affects the reliability and electrical life of any electrical connections within the electrical engineering. In this paper, finite element model of typical spring structure components is built by using COMSOL Multiphysics software. Furthermore, the transient process of contact temperature is simulated by taking account of film resistance on the contact surface. Moreover, a test rig is introduced that makes it possible to measure the electrical contact resistance and temperature within the electrical contact components simultaneously. Finally, correlation between contact resistance and contact spot temperature with different contact force and current levels are investigated explicitly.