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Hotspot Liquid Microfluidic Cooling: Comparing The Efficiency between Horizontal Flow and Vertical Flow
Author(s) -
Yuki Okamoto,
Hiroyuki Ryoson,
Koji Fujimoto,
Keiji Honjo,
Takayuki Ohba,
Yoshio Mita
Publication year - 2016
Publication title -
journal of physics conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/773/1/012066
Subject(s) - limiting , hotspot (geology) , materials science , mechanics , horizontal and vertical , computer science , physics , geology , mechanical engineering , engineering , geodesy , geophysics
This paper reports a novel cooling method for a local high-temperature block in an integrated circuit, which is called a "hotspot". The method is to cool the chip in out-of-plane (3-D) direction to overcome efficiency limit of traditional horizontal (2-D) cooling. Our result indicates that high-temperature (over 180 °C) circuit block such as a phase-locked-loop (PLL), which is a performance limiting block in a modern CPU, can more efficiently be cooled by the vertical (3-D) cooling scheme.

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