Open AccessLaser optoacoustic non-destructive method of thickness measurement of subsurface damaged layer in machined silicon wafers
Author(s) -
N. B. Podymova,
A. A. Karabutov
Publication year - 2010
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/214/1/012054
Subject(s) - wafer , materials science , laser , layer (electronics) , silicon , optics , optoelectronics , composite material , physics