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Patterning using a focused ionizing radiation beam provides a high spatial resolution but is not feasible when creating large arrays of microstructures. We propose the optimization of x-ray lithography parameters to create submicropores in a low-sensitivity material (polyethylene terephthalate) using a wide x-ray beam. This optimization results in the fabrication of regularly arranged micropores with a high aspect ratio (over 20) and diameters of up to 0.4  µ m across a large substrate area (up to several square centimeters).

Optimization of x-ray lithography conditions for fabrication of large arrays of high-aspect-ratio submicron pores