Open AccessLow-temperature metal/Zerodur heterogeneous bonding through gas-phase processed adhesion promoting interfacial layers
Author(s) -
Katherine N. Klokkevold,
Weston Keeven,
Dong Hun Lee,
Michael Clevenger,
Mingyuan Liu,
Kwangsoo No,
Han Wook Song,
Sunghwan Lee
Publication year - 2022
Publication title -
aip advances
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/6.0002114
Subject(s) - materials science , ceramic , composite material , thermal expansion , bond strength , alloy , metallic bonding , temperature cycling , metal , metallurgy , layer (electronics) , adhesive , thermal , physics , meteorology
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