Open AccessLow-temperature copper–copper quasi-direct bonding with cobalt passivation layer
Author(s) -
Peng Wang,
Yun-Hao Shao,
Zi-Hong Ni,
Chun-Feng Hu,
Xin-Ping Qu
Publication year - 2022
Publication title -
aip advances
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/5.0108693
Subject(s) - materials science , anodic bonding , passivation , nanocrystalline material , direct bonding , copper , annealing (glass) , cobalt , thermocompression bonding , surface roughness , secondary ion mass spectrometry , layer (electronics) , composite material , transmission electron microscopy , wire bonding , metallurgy , analytical chemistry (journal) , silicon , nanotechnology , ion , chemistry , chip , organic chemistry , engineering , electrical engineering , chromatography
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