Open AccessEngineering and understanding of thermal conduction in materials
Author(s) -
Sangyeop Lee,
Renkun Chen,
Sébastian Volz
Publication year - 2022
Publication title -
journal of applied physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.699
H-Index - 319
eISSN - 1089-7550
pISSN - 0021-8979
DOI - 10.1063/5.0106187
Subject(s) - thermal conduction , materials science , thermal , engineering physics , thermodynamics , engineering , physics , composite material
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