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Investigation of the influence of submicron spherical diamond particles and silicon whiskers on the thermal conductivity of thermal greases
Author(s) -
Р. А. Шишкин
Publication year - 2022
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/5.0098840
Subject(s) - whiskers , thermal conductivity , materials science , diamond , silicon , composite material , thermal grease , composite number , thermal , optoelectronics , physics , meteorology

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