Open AccessEffect of post-metallization anneal on (100) Ga2O3/Ti–Au ohmic contact performance and interfacial degradation
Author(s) -
MingHsun Lee,
TaShun Chou,
Saud Bin Anooz,
Zbigniew Galazka,
Andreas Popp,
Rebecca L. Peterson
Publication year - 2022
Publication title -
apl materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.571
H-Index - 60
ISSN - 2166-532X
DOI - 10.1063/5.0096245
Subject(s) - ohmic contact , materials science , contact resistance , diffusion barrier , oxide , annealing (glass) , degradation (telecommunications) , layer (electronics) , composite material , metallurgy , electronic engineering , engineering
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