Open AccessThermal stability and bonding interface in Cu/SiO2 hybrid bonding on nano-twinned copper
Author(s) -
Jou-Chun Ou,
Yi-Yun Tsai,
TingChun Lin,
ChinLi Kao,
Shih-Chieh Hsiao,
Fei-Ya Huang,
JuiChao Kuo
Publication year - 2022
Publication title -
aip advances
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/5.0088158
Subject(s) - materials science , microstructure , thermal stability , copper , scanning electron microscope , composite material , electron backscatter diffraction , grain size , nano , metallic bonding , nanoindentation , crystallography , metallurgy , metal , chemical engineering , chemistry , engineering
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