Study on the relationship between surface and dislocation of nanoporous copper under cyclic shear loading
Author(s) -
Yufeng Wang,
Wenbo Bi,
Lei Deng,
Xingming Zhang,
Jianfeng Tang,
Liang Wang
Publication year - 2022
Publication title -
aip advances
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/5.0085569
Subject(s) - dislocation , nanoporous , copper , materials science , shear (geology) , surface (topology) , peierls stress , shear stress , crystallography , composite material , condensed matter physics , metallurgy , dislocation creep , nanotechnology , chemistry , geometry , physics , mathematics
In this paper, molecular dynamics simulation is conducted to study the relationship between the surface and dislocation of nanoporous copper under cyclic shear loading. The results show that the dislocation and the surface have both mutual promotion and competition relationship. On one hand, the surface becomes rough owing to reconstruction caused by cyclic shear, which promotes the dislocation activities, while the dislocation activities also accelerate the process of surface reconstruction. On the other hand, there is a competition between surface reconstruction and dislocation activities: in the early cycles, the dislocation density is low, and surface reconstruction dominates stress release; in the late cycles, the surface tends to be stable, and then, the dislocation activities dominate.
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